Tin Plating
MSA Process Technology For Precise Tin Plating
Challenges for Tin Plating
Depending on the tin plating technology utilized, processes face challenges including excessive tin loss, sludge generation, high process costs, and narrow process temperature ranges. By nature, the PSA (phenol sulfonic acid) electrolyte process draws tin toward the edges of the steel strip while plating, resulting in uneven plating and high tin consumption while the halogen process creates the highest amount of Sn sludge, leading to higher costs, and inconsistent quality.
Optimizing Operations
MSA (methane sulfonic acid) technology applies tin to steel substrates for the packaging industry with the lowest applied tin cost and lowest environmental impact. As a result, the tin plating process:
Maintains a uniform tin grain structure
Has a simple process control and solution analysis
Gains operating advantages with significant cost savings
Tin Plating Solutions for High Speed Electro-Tin Line Applications
Tinplate Rolling
MSA (Methanesulfonic Acid)
Tin Concentrate
Antioxidant
Plating Additive
Tin Passivate
Flux Concentrate